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ZER-S109

Compression Load Cell

Load Cells

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Computer Chip

Features & Applications:


1. Low profile, small deformation and small size;


2. Stainless steel material;


3. High temperature performance can be customized for injection moulding, backlog and other manufacturing processes;


4. It is suitable for automobile press assembly, automatic assembly, 3C product testing, new energy product assembly, medical inspection, robotics, mold assembly and other industrial testing, measurement and control systems;


5. High dynamic response frequency.

Technical Parameter

Specifications
Technique
Capacity
50,100,200,500,1000N
Rated output
1.5±20%mV/V
Zero balance
± 0.05mV/V
Non-linearity
0.50%F.S.
Hysteresis
0.20%F.S.
Repeatability
0.20%F.S.
Temp.effect on output
0.05%F.S./10℃
Temp.effect on zero
0.05%F.S./10℃
Input impedance
700±20Ω
Output impedance
700±10Ω
Insulation
≥5000MΩ/100VDC
Recommended excitation
5~15V
Maximum excitation
20V
Compensated temp range
-10~60℃
Operation temp range
-20~80℃
Safe overload
150%F.S.
Ultimate overload
200%F.S.
Cable size
φ3×3000mm
TEDS
OPTIONAL

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